Revolutionizing Automotive Electronics With Two-in-One Rectifier And TVS Integration
Innovative Device Merges a 3 A, 600 V Standard Rectifier with a 200 W TRANSZORB TVS in a Space-Efficient FlatPAK 5 x 6 Package New...
The Rise of RISC-V: From University Lab to Global Force in Silicon Design
This article is part of the TechXchange: RISC-V: The Instruction-Set Alternative. What you’ll learn:SiFive’s role in creating RISC-V and driving it forward.How RISC-V transformed...
Small And Thin Standard Logic Packages In 14, 16, 20 and 24 Pins
These new packages enable large logic functions to be included in small form factor systems for higher system performance Claiming to be the world’s smallest...
7 Best Pink PC Cases Reviews in 2024
While building a custom PC, you can find a wide range of computer cases out there which have all kinds of form factors and...
How to Fix a Blank White Screen in Windows
The Windows operating system has its fair share of errors and problems and users come across a variety of different problems every now and...
Infineon Pairs Memory Tech for Automotive
//php echo do_shortcode('') ?> SPI NOR flash is running out of gas, at least for automotive applications, so Infineon Technologies is pairing the...
Field Application Engineer At STMicroelectronics In Bengaluru
- Advertisement - Location: Bengaluru
Company: STMicroelectronics
Your Role as a ‘Field Application Engineer In The ‘EMEA Sales & Marketing Organization’
The main part of the role is...
Modern Router Combo Vs Seperate – Which Is Better?
Are you at the crossroads of making a choice between a separate setup or modem-router combo for your new home internet setup?
We understand that...
Bird-Like Drone For Unseen Environment Navigation
Researchers at Massachusetts Institute of Technology have developed organic brain-inspired flight navigation agents for vision-based tasks in new and complex settings. Makram Chahine, a PhD...
1NT591A – array of 2 npn BJT transistors : weekend die-shot
Designed for input stages of differential amplifiers. Datecode 0675.Die size 1241x748 µm.
Latest article
U.S. Fab Capacity Poised to Explode in the Next Decade
On top of that, the U.S. is expected to amass 28% of global capital expenditures in chips from 2022 to 2032. That would put...
NXP MCUs Leverage Cloud-Based Development Environment to Empower Software-Defined Vehicles
Developing software-defined vehicles (SDVs) is challenging, but offers advantages such as upgradable features and new revenue streams. However, the growth of hardware-defined variants across...
Switching Power Supply History: From Theory to Design Essential
This article is found in the Electronic History section of our Series Library.
What you’ll learn: The history of the switching power supply.
How have these supplies...
